RRAM-HfO2-2026-018

TiN/HfOₓ/Ti/Pt memristor — resistive-switching endurance

Identity

Sample IDRRAM-HfO2-2026-018
TitleTiN/HfOₓ/Ti/Pt memristor — resistive-switching endurance
StatusCompleted
OperatorB. Çelik
Laboratory / FacilityNano-Device Research Group

Substrate / Material

Substrate MaterialTiN / SiO₂ / Si
Active Layer MaterialSub-stoichiometric HfOₓ (≈10 nm, ALD)

Notes

TagsRRAM, memristor, endurance, SET/RESET, oxygen vacancy
NotesDOE condition O₂=8% (from PROJ-RRAM-2026-DOE). 50×50 µm device.

Process Steps

HfOₓ active layer — ALD (Thin Film Deposition)

TechniqueALD
Material / Target / PrecursorHfO₂ (TDMAHf + H₂O), oxygen-poor setting
Purity99.99% precursor
EquipmentBeneq TFS200
Chamber Pressure~1 mbar
Substrate Temperature (°C)200
Duration (min)25
Rate (nm/min or Å/s)~1.0 Å/cycle, 100 cycles
Target Thickness (nm)10
Measured Thickness (nm)9.6
Final StepTop electrode Ti(10 nm)/Pt(50 nm) e-beam, shadow mask

Electroforming + DC switching (Measurement Context)

InstrumentKeysight B1500A + WGFMU
Calibration StatusValid
Uncertainty (±)±0.5% I
CaptionForming +3.2 V (compliance current 1 mA); then DC SET/RESET cycling.
V_SET ≈ +0.9 V · V_RESET ≈ −1.1 V · R_LRS ≈ 2.5 kΩ · R_HRS ≈ 180 kΩ (×72 window).

Endurance cycling (Measurement Context)

InstrumentKeysight B1500A — pulsed SET/RESET + read
Calibration StatusValid
Uncertainty (±)±0.5% R
CaptionEach cycle: SET pulse + RESET pulse + non-destructive read (0.2 V). R=|V/I|; LRS/HRS vs number of cycles.
MikroFab Endurance module (Figure S11 type). >10⁴ cycles; window started to close.

Endurance metrics (vs target) (Result (Spec))

ParameterValueUncertainty (±)UnitSpecificationPass
First-failure cycle1.4e4cycles≥1e4
Initial HRS/LRS window728×≥10
Window at 10⁴ cycles14×≥10
V_SET0.90.1V≤1.5
Forming voltage3.20.2V≤4

Failure analysis comment (Free Note)

Window closure is most likely due to redistribution of oxygen vacancies in the filament (HRS decreasing). Increasing the top-electrode Ti thickness (oxygen getter) could improve endurance — a recommendation for the next DOE round.