PROJ-RRAM-2026-DOE

HfOₓ memristor material screening — project planning notebook

Identification

Sample IDPROJ-RRAM-2026-DOE
TitleHfOₓ memristor material screening — project planning notebook
StatusIn progress
OperatorPrincipal Investigator: Dr. S. Aydın
Laboratory / FacilityNano-Device Research Group

Notes

Tagsplanning, DOE, RRAM, memristor, TÜBİTAK
Notes3 oxygen ratios × 2 top-electrodes = 6 conditions; 8 devices per condition. Design of experiments (DOE).

Process Steps

Research question and hypothesis (Objective / Hypothesis)

Research QuestionHow does the oxygen partial pressure in the HfOₓ active layer affect the SET/RESET voltages and the endurance of the RRAM device?
HypothesisOxygen-poor (sub-stoichiometric) HfOₓ contains more oxygen vacancies → lower forming voltage but a narrower HRS/LRS window.
Expected ResultAt an intermediate oxygen ratio (≈8% O₂), the best balance between forming voltage and window ratio; >10⁴ cycle endurance.
Independent VariableO₂ partial pressure during sputtering (4% / 8% / 12%)
Dependent VariableV_SET, V_RESET, R_LRS/R_HRS window, first-failure cycle
Control VariableBottom electrode (TiN), layer thickness (10 nm), device area (50×50 µm)

Materials / procurement list (Materials / Shopping List)

ItemSupplierCatalog NoQuantityUnit PriceStatus
HfO₂ sputter target 3"Kurt J. LeskerEJTHFO2-31€780Received
TiN-coated Si wafer 4"University WaferTIN-100-52510€45Received
Pt target 2"Kurt J. LeskerEJTPT-21€1240Ordered
Ti target 2"Kurt J. LeskerEJTTI-21€210In stock
Probe tip W (10 µm)GGB PicoprobePP-104€95Received

Project team and collaborators (Person / Collaborator)

NameRoleInstitutionEmailPhoneORCID
Dr. S. AydınPrincipal InvestigatorNano-Device Group[email protected]+90 312 000 00010000-0002-1111-2222
B. ÇelikPhD studentNano-Device Group[email protected]0000-0001-3333-4444
Prof. L. MoreauAdvisor (TEM)CNRS Grenoble[email protected]0000-0003-5555-6666

Key instrument: parameter analyzer (Equipment / Instrument)

Instrument NameSemiconductor parameter analyzer
ModelKeysight B1500A
Serial NoMY12345678
LocationMeasurement room 2, probe station
Calibration Date2026-09-30
SettingsPulsed I-V with the WGFMU module; current compliance 1 mA (forming protection).
Reservation / UserMon/Wed/Fri 09:00–13:00 — B. Çelik

Project milestones (Timeline)

MilestoneStartEndDone
Target + wafer procurement2026-04-012026-04-15
6-condition device fabrication2026-04-162026-05-20
Electrical screening (forming/endurance)2026-05-212026-06-20
TEM cross-section + analysis (Grenoble)2026-06-212026-07-15
Manuscript draft2026-07-162026-08-30

Measurement setup wiring diagram (Connection / Wiring)

SourceDestinationCable / PortSignalNote
B1500A SMU1Top electrode probetriax — ForceV_program (±5 V)pulsed source
B1500A SMU2TiN bottom electrode (chuck)triax — GND0 V / current readbackcommon ground
Probe stationFaraday cageBNC braidshieldingnoise suppression

Key reference paper (Reference / Citation)

AuthorsWong H.-S. P. et al.
TitleMetal-Oxide RRAM
Journal / PublicationProceedings of the IEEE
Year2012
DOI10.1109/JPROC.2012.2190369
URLhttps://ieeexplore.ieee.org/document/6193402
Relevance / NoteFoundational for the forming/SET/RESET mechanism and the oxygen-vacancy filament model.